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Shixin CHEN (陈时鑫)Ph.D. Student |
Biography
I am a third-year Ph.D. Student at the Department of Computer Science and Engineering, The Chinese University of Hong Kong (CUHK), under the supervision of Prof. Bei Yu since Fall 2022. Before that, I received my B.Eng. degree in VLSI Design and System Integration at the School of Electronic Science and Engineering, Nanjing University in 2022. In 2018, I obtained my high school diploma at Shishi Senior High School in Chengdu.
Recent News
Nov/2024: Congratulations! Our work on survey of 2.5D integration from EDA perspective is accepted by ASP-DAC 2025!
Feb/2024: Congratulations! Our work on Winograd convolution FPGA IP generation has been accepted by DAC 2024!
Dec/2023: Congratulations! Our work on floorplanning of chiplet has been accepted by TCAD!
Sept/2023: Congratulations! Our work on DNN-targeting SoC design has been accepted by ASP-DAC 2024!
Aug/2022: I start my Ph.D. study in Hong Kong.
Jun/2022: I graduated with the honor of Outstanding Graduate of Jiangsu Province.
Apr/2022: I have been awarded the Hong Kong PhD Fellowship Scholarship since 2022.
Dec/2021: I have been awarded the honor of Person of the Year (2021), 10 awardees from all undergraduates and postgraduates at NJU. (photo) (NJU-news)
Nov/2021: I have been awarded the honor of the Dongliang Special Scholarship, 12 awardees from all undergraduates at NJU. (NJU-news)
Education
Ph.D. Computer Science and Engineering, CUHK, Aug 2022 - Now
B.Eng. (Elite class, Rank 2ed), VLSI Design and System Integration, NJU, Sept 2018 - June 2022
Research Interests
Design Space Exploration of Architecture
3D/2.5D IC and Chiplet
Agile Hardware Design
Hardware Accelerator
Machine Learning in EDA
Publication
(* represents equal contribution)
Conference Paper
[C3] Shixin Chen, Hengyuan Zhang, Zichao Ling, Jianwang Zhai, Bei Yu, “The Survey of 2.5D Integrated Architecture: An EDA perspective”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASP-DAC), Japan, Jan. 21–23, 2025. (Invited Paper)
[C2] Mingjun Li*, Pengjia Li*, Shuo Yin, Shixin Chen, Beichen Li, Chong Tong, Jianlei Yang, Tinghuan Chen, Bei Yu, “WinoGen: A Highly Configurable Winograd Convolution IP Generator for Efficient CNN Acceleration on FPGA”, ACM/IEEE Design Automation Conference (DAC), 2024.
[C1] Shixin Chen, Su Zheng, Chen Bai, Wenqian Zhao, Shuo Yin, Yang Bai, Bei Yu, “SoC-Tuner: An Importance-guided Exploration Framework for DNN-targeting SoC Design”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASP-DAC), South Korea, Jan. 22–25, 2024.(slides)
Journal Paper
[J2] Shixin Chen, Shanyi Li, Zhen Zhuang, Su Zheng, Zheng Liang, Tsung-Yi Ho, Bei Yu, Alberto L. Sangiovanni-Vincentelli, “Floorplet: Performance-aware Floorplan Framework for Chiplet Integration”, accepted by IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).
[J1] Yang Bai, Xufeng Yao, Qi Sun, Wenqian Zhao, Shixin Chen, Zixiao Wang, Bei Yu, “GTCO: Graph and Tensor Co-Design for Transformer-based Image Recognition on Tensor Cores”, accepted by IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).
Selected Awards
| Hong Kong PhD Fellowship Scholarship (HKPFS) | Research Grant Council of Hong Kong | 2022 |
| CUHK Vice-Chancellor's PhD Scholarship | The Chinese University of Hong Kong | 2022 |
| Chenxue Overseas Study Scholarship | Nanjing University | 2022 |
| Outstanding Graduate of Jiangsu Province | The Education Department of Jiangsu Province | 2022 |
| The Star of Self-Improvement | National Union of Students of PRC | 2021 |
| The Person of the Year of NJU | Nanjing University | 2021 |
| The Dongliang Special Scholarship | Nanjing University | 2021 |
| National Scholarship | Education Ministry of PRC | 2019 |
| People's Scholarship | Nanjing University | 2019-2021 |
| National Encouragement Scholarship | Education Ministry of PRC | 2020-2021 |
| Student Model of Jiangsu Province | Nanjing University | 2020 |
| The Yang Lanyun Leadership Scholarship | Nanjing University | 2020 |
| Electronic Design Competition Second Prize | Jiangsu Province | 2020 |
| Sichuan Chamber of Commerce Scholarship | Sichuan Chamber of Commerce of Jiangsu Province | 2019 |
Experiences
Research Intern, Heterogeneous Computing Group
Jul. 2021 – Sept. 2022, Shenzhen, Guangdong Province
Topic: Hardware Accelerator for Super-resolution Video
Huawei Noah's Ark Lab
Research Intern, AI4EDA Group
Sept. 2023 – Dec. 2023, Shenzhen, Guangdong Province
Topic: Large Language Model for Hardware Verification
Academic Service
Conference Reviewer
ACM The International Symposium on Physical Design (ISPD) 2024
ACM/IEEE Asia and South Pacific Design Automation Conference (ASP-DAC) 2025
Jornal Reviewer
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD)
IEEE Transactions on Very Large Scale Integration Systems (TVLSI)
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Skills
Software Languages: C, C++, Python, Bash
Hardware Languages: SystemVerilog, Chisel
Tools: Xilinx Vivado, PyTorch, LaTeX
Hobbies: Guitar, Chinese Calligraphy, Badminton
Teaching
CSCI2010, 2023-Fall, Digital Logic Design Laboratory
CSCI3420, 2023-Spring, Computer Organiztaion and Design
CSCI3420, 2024-Spring, Computer Organiztaion and Design